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Hydrogenated Bisphenol A Epoxy Resin CAS 30583-72-3

Hydrogenated Bisphenol A Epoxy Resin Details:
  • Chemical Name: Hydrogenated Bisphenol A Epoxy Resin
  • CAS No.:30583-72-3
  • Molecular formula:C18H33ClO3
  • Molecular weight: 332.91
  • Appearance:Colorless liquid
  • Assay :60%
Hydrogenated Bisphenol A Epoxy Resin Specification:
Items Specification
Assay 99.0%MIN
Cr,% 14.5%MIN
Melting Point 212℃
CAS NUMBER 21679-31-2
Hydrogenated Bisphenol A Epoxy Resin Application:

Used in the casting, encapsulation, impregnation, 3D printing and other industries of industrial weathering coatings and electronic materials

Hydrogenated Bisphenol A Epoxy Resin Packaging Details:

25kg/Drum or as your requirement


Store at dry, dark and ventilated place.

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